80*80mm 90*90mm BGA Reballing Station Auto Magnet Solder Ball Stencil Holder IC Reballing Repair Tools
Quick Positioning, with magnetically attach, with locking pins
Supported chip range: 4mm~45mm
Suitable for stencil size: 80*80mm, and 90*90mm
Features:
Aluminum alloy structure, the structure is light and durable. It has automatic centering function, rotate spiral plate, four position holes, four clamping blocks lock chip at same time, no need to adjust one by one. Good positioning accuracy, fast clamping speed and high efficiency. The station can match different stencils that can be used for corresponding BGA of different sizes. It can match 80*80mm and 90*90mm stencils(not included), high efficiency, wide suitability.
Specifications:
Material: Aluminum alloy
Suitable Stencil: Support for 80mm*80mm, 90mm*90mm stencils
Weight: 635g(approx.)
Package Includes:
1 x Reballing Station (stencils are NOT included)
5 x Screws
1 x Hex Key
Rotate the turntable to adjust the clamping size. Place the chip and clamp it firmly. Fit the magnetic lower frame of the stencil. Put the stencil in place and align it with the holes. Hold the stencil with one hand while fitting the magnetic upper frame with the other. Release your hand to allow the two frames to align and magnetically attach, securing the stencil without the need for screws.
Apply a thin layer of soldering paste to the chip. Fit the stencil frame, evenly sprinkle solder balls, and shake the ball placement platform to ensure each hole in the stencil is filled with a solder ball. Pour the excess solder balls back into the bottle. Remove the stencil frame smoothly and then take out the chip steadily. Place the chip on a heat-insulating pad to heat the solder balls. Remove the nozzle and use a gentle stream of hot air, with the temperature set according to the melting point of the solder balls. Alternatively, heat the chip on a heating stage. For leaded solder balls, set the temperature to 230°C; for lead-free ones, set it to 255°C. Do not directly heat the stencil with a hot air gun, as the large area of the stencil will cause it to bulge, expand, and deform when heated directly.
